Nuclear Magnetic Resonance
RIE-ICP Etcher
Model:
STS Pro- platform
Status:
Operational
Location:
2145
Description:
Dry etching SiO2 Wafer • Gases available for etching: CF4, C4F8, CHF3, O2 & Ar • RF power source: 1x 1200W at 13.56MHz for Coil electrode • 1x 300W at 13.56MHz for Platen electrode • Substrate size: 4” single wafer or smaller
Remark:
Technician will turn on the machine 1h before your booking session. Charging will start from the time when the machine is ON until it is switched off. Maximum booking - 1 day per week.