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Surface Science
Surface analysis Kratos Axis Ultra
TOF SIMS V
Scanning Probe Microscopy
Scanning Probe Microscope_Dimension ICON
X-Ray Diffraction
Multi-purpose XRD
Panalytical Empyrean MultiCore PIX3D
Powder X-ray diffractometer_PANalytical
Nuclear Magnetic Resonance
Varian NMR spectrometer
Thin Film
Evaporation system - Explorer 14
KLA-Tencor Alpha-Step Stylus Profiler
Sputtering system-Explorer
Thin Film Sputtering System-Denton
Optical Characterisation
Bruker FTIR
Ellipsometer_Woollam
MicroRaman/Photoluminescence System
Near-field Imaging/Spectroscopy
Renishaw inVia Qontor Spectrometer System
UV-VIS-NIR Spectrophotometer
Electrical/Magnetic Characterisation
Cryostat
Electrochemical Analyzer
Hall effect measurement system
Solar Cell Simulation and I-V Test Station
Thermal Analysis
Discovery DSC 2500
DSC TA Q1000
TGA Q5000
TGA-5500
TGA/DTA Setaram
Thermal conductivity_Discovery
Sample Preparation-General
Band Saw_Allied
Centorr High Temp Vacuum Furnace
Diamond Saw1_4
Diamond Wheel Saw 4' II
Electric Balance
Glass Maker
Hand Polishing Equipment
High Speed Digital Camera
High Temperature Furnace
High Temperature Furnance II
Image Analysis System Q600
Mechanical Polish/Lapping Equipment III
Metallurgical Microscope and Image Analysis System Q500
Microhardness Tester
Olympus Optical Microscopy
Polisher1_8
Precision wire saw
Rotary Microtome
Sample mounting
Sieve shaker
Sliding Microtome
Vacuum oven
Wire Saw
Sample Preparation-Electron_Microscopy
Abrasive Slurry Disc Cutter
Carbon Coater
Dimpler grinder
Fischione Ion Miller
Gold Sputter Coater
Ion Beam Miller 691
Platinum Sputter Coater_Quorum
Ultrasonic Disk Cutter
Element Analysis
X-ray fluorescence spectrometer
Nano Fabrication
Desktop sputtering system
Dual Beam FIB/SEM
E-beam Evaporation System-Peva
E-beam for metal
E-beam for oxide
e-LiNE
Focused Ion Beam (I)
Focused Ion Beam (II)
Mask Aligner
Optical microscope
Oven
Physical Property Measurement System
Plasma cleaner
RIE-ICP Etcher
Spin Coater and Hot Plate
Wedge bonder (AB520)
Wedge bonder (AB550)
Liquid Helium Plant
Helial Liquefaction System
Helium Liquefier System
Scanning Electron Microscopy-SEM
Environmental SEM
JEOL-6390 SEM
JEOL-6700F SEM
JEOL-7100F SEM
JEOL-7800F SEM
Transmission Electron Microscopy-TEM
Aberration Corrected TEM
JEOL 100CX TEM
JEOL 2010 TEM
JEOL 2010F TEM
Wedge bonder (AB520)
Model:
ASM AB520
Status:
Operational
Location:
2145
Description:
• Bond method: ultrasonic frequency bonding • Fine pitch capability: 80um Pad pitch and 70um Pad Size @ 1.0 mil Al wire with the bond angle of 30o • Auto-alignment in optics system and PC-based control system
Technology:
NanoScience and Engineering
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