Nuclear Magnetic Resonance
Wedge bonder (AB520)
Model:
ASM AB520
Status:
Operational
Location:
2145
Description:
• Bond method: ultrasonic frequency bonding • Fine pitch capability: 80um Pad pitch and 70um Pad Size @ 1.0 mil Al wire with the bond angle of 30o • Auto-alignment in optics system and PC-based control system